According to industry sources, with the continuous growth and popularity of 5G and artificial intelligence skills, notebook computers have become more intelligent, which has spurred the demand for high-density interconnect (HDI) printed circuit boards (PCBs). People in the movement said that because of the increasingly fierce competition among the major chip makers, the upgrade of the processor has become the primary driving force for improving the notebook computer's HDI board skill penetration rate.
At the just-concluded Consumer Electronics Show 2019, Intel launched Athena's intention to spur notebook computer makers to produce advanced models with 5G and artificial intelligence, and announced that its 10-nanometer ice lake disposer will be this year roll out. Suppliers including Acer, Asus, Dell, Google, HP, Reverie, Microsoft, Samsung, and Sharp are all working to spur Athena's plans.
Both Intel and Qualcomm have exaggerated continuous Internet connectivity, long battery life, and immediate response in their next-generation notebook processor. Industry insiders said that compared with ordinary PCBs, HDI PCBs have the characteristics of thinner lines, smaller space, smaller pore size and more layers. Some people say that HDI skills can also solve the problem of overheating and high signal loss of the notebook computer during ultra-high data transmission during 5G.
At the same time, with the continuous decline in the cost of NAND flash memory, the cost of SSDs has also fallen sharply, which has also greatly increased the penetration rate of SSDs in notebook computers. Because SSD modules usually accept HDI boards, this also provides a good exit for HDI PCBs.
